CM Capabilities

At UPE we partner with you for electronic assembly. We like to think of ourselves as an extension of your operations. Our goal is to increase your efficiency, reduce cost and improve quality. To accomplish this goal, we offer a number of custom services, including the following.


UPE can assist companies large and small with the purchasing of material for anything from prototype to production. We have over 60 years combined knowledge in the Electronic Components field, that allows us to find the best solution to your material needs. We can manage material from a single part to a complete BOM or your entire product line.

Prototype and quick-turn assembly

  • Quick Turn – 1 to 7 days
  • Machine placement down to 01005 size
  • BGA/CSP to 0.3mm pitch
  • Rigid, Flex and Rigid-Flex Assembly

Multiple Solder Methods

  • Wave Solder – bulk soldering process used for the manufacturing of PCBAs.
  • Reflow – most widely used method of attaching surface mount components.
  • Dip soldering – submerging parts to be joined, into a molten solder bath.
  • Selective solder – process to solder individual through hole components using a solder fountain.
  • Hand soldering – Labor intensive but allows for flexibility.



UPE can work with any components – Surface Mount, Through-Hole, BGA / CSP


  • Machine placement down to 01005 size
  • BGA / CSP to 0.3mm pitch

Cabling and Wiring

  • Custom Wire harness

Box Build


After assembling your PCBA can be integrated into an enclosure / box including all:


  • Programming
  • Testing
  • Cables / Power supply
  • Technical documents
  • Accessories

QA inspection

  • AOI – Automated optical inspection
  • SPI – solder paste inspection
  • X-ray inspection